Add：-701, Unit 2, Building 2, Hongchuang Technology Center, Xikeng Community, Fucheng Street, Longhua District, Shenzhen | Non-destructive Laser Splitter (FLC-7200) | ||||||||||||||||
Introduction:
A new generation of non-cooling non-destructive cutting technology. Technology The use of self-developed laser spot shaping and laser waveform customization technology, so that the silicon material in a very short time to form a predetermined change in the temperature field, the use of laser temperature field and space temperature difference to form a regular thermal stress gradient, to induce the silicon wafer along the laser prefabricated slot to form cracks and guide crack growth, in the case of no atomizing liquid cooling to separate the battery.
Features:
1. The machining section is neat, no obvious cracks burrs and damage
2. Less non-destructive cutting section lines, high bending strength of the battery,
3. The processing temperature is 160°, the low temperature does not damage the silicon substrate of the battery, and the HJT battery is cut
Half-efficiency loss <0.2%. Compatible with high-efficiency splicing methods such as narrow spacing negative spacing
TOPCON battery half-cutting efficiency loss <0.15%,
Process:
Main process: feeding → slotting → splicing → testing → cutting
Pictures:
Battery positive effect Δ
Crystal silicon cross section effect Δ Section effect Δ
Battery segment surface Δ |
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Wechat
Add：701, Unit 2, Building 2, Hongchuang Technology Center, Xikeng Community, Fucheng Street, Longhua District, Shenzhen 101, Building 2, No. 13, Shalingbian Road, Tangxia Town, Dongguan City, Guangdong ProvinceTel：86-755-23765416 Fax：86-755-27189463
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