Perovskite laser marking machine
Satisfy the slicing and cutting of metal materials, silicon, germanium, gallium arsenide, silicon carbide, and other semiconductor substrate materials,
Can process solar panels, perovskite cell modules, silicon wafers, ceramic wafers, aluminum foil sheets, etc.
equipment features
2. Higher pulse energy instantly etches off the surface of the material to achieve precise control of etching depth and range.
production process
product parameters
| serial number | project | specifications |
|---|---|---|
| 1 | Equipment size | 1600mm*1400mm*1800mm |
| 2 | platform accuracy | ±5μm（100mm） |
| 3 | sports platform | marble+air floating module+grating ruler |
| 4 | Laser | Infrared and Green P1:< 30 ± 5 μm |
| 5 | Control System | PC Base Control+CCD |
| 6 | Strokes | X>200mm Y>400mm |
| 7 | Vacuum adsorption | 200mm*400mm(customizable) |
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